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CY7C1354A CY7C1356A
256K x 36/512K x 18 Pipelined SRAM with NoBLTM Architecture
Features
* Zero Bus LatencyTM, no dead cycles between Write and Read cycles * Fast clock speed: 200, 166, 133, 100 MHz * Fast access time: 3.2, 3.6, 4.2, 5.0 ns * Internally synchronized registered outputs eliminate the need to control OE * Single 3.3V -5% and +5% power supply VCC * Separate VCCQ for 3.3V or 2.5V I/O * Single WEN (Read/Write) control pin * Positive clock-edge triggered, address, data, and control signal registers for fully pipelined applications * Interleaved or linear four-word burst capability * Individual byte Write (BWa-BWd) control (may be tied LOW) * CEN pin to enable clock and suspend operations * Three chip enables for simple depth expansion * Automatic power-down feature available using ZZ mode or CE select * JTAG boundary scan * Low-profile 119-bump, 14-mm x 22-mm BGA (Ball Grid Array), and 100-pin TQFP packages All synchronous inputs are gated by registers controlled by a positive-edge-triggered clock input (CLK). The synchronous inputs include all addresses, all data inputs, depth-expansion Chip Enables (CE, CE2, and CE3), Cycle Start Input (ADV/LD), Clock Enable (CEN), Byte Write Enables (BWa, BWb, BWc, and BWd), and Read-Write Control (WEN). BWc and BWd apply to CY7C1354A only. Address and control signals are applied to the SRAM during one clock cycle, and two cycles later, its associated data occurs, either Read or Write. A clock enable (CEN) pin allows operation of the CY7C1354A/CY7C1356A to be suspended as long as necessary. All synchronous inputs are ignored when (CEN) is HIGH and the internal device registers will hold their previous values. There are three chip enable pins (CE, CE2, CE3) that allow the user to deselect the device when desired. If any one of these three are not active when ADV/LD is LOW, no new memory operation can be initiated and any burst cycle in progress is stopped. However, any pending data transfers (Read or Write) will be completed. The data bus will be in high-impedance state two cycles after chip is deselected or a Write cycle is initiated. The CY7C1354A and CY7C1356A have an on-chip two-bit burst counter. In the burst mode, the CY7C1354A and CY7C1356A provide four cycles of data for a single address presented to the SRAM. The order of the burst sequence is defined by the MODE input pin. The MODE pin selects between linear and interleaved burst sequence. The ADV/LD signal is used to load a new external address (ADV/LD = LOW) or increment the internal burst counter (ADV/LD = HIGH) Output Enable (OE), Sleep Enable (ZZ) and burst sequence select (MODE) are the asynchronous signals. OE can be used to disable the outputs at any given time. ZZ may be tied to LOW if it is not used. Four pins are used to implement JTAG test capabilities. The JTAG circuitry is used to serially shift data to and from the device. JTAG inputs use LVTTL/LVCMOS levels to shift data during this testing mode of operation.
Functional Description
The CY7C1354A and CY7C1356A SRAMs are designed to eliminate dead cycles when transitioning from Read to Write or vice versa. These SRAMs are optimized for 100% bus utilization and achieve Zero Bus Latency (ZBL)/No Bus Latency (NoBL). They integrate 262,144 x 36 and 524,288 x 18 SRAM cells, respectively, with advanced synchronous peripheral circuitry and a two-bit counter for internal burst operation. These employ high-speed, low-power CMOS designs using advanced triple-layer polysilicon, double-layer metal technology. Each memory cell consists of four transistors and two high-valued resistors.
Selection Guide
7C1354A-200 Maximum Access Time Maximum Operating Current Commercial Maximum CMOS Standby Current Commercial 3.2 560 30 7C1354A-166 7C1356A-166 3.6 480 30 7C1354A-133 7C1356A-133 4.2 410 30 7C1356A-100 5.0 350 30 Unit ns mA mA
Cypress Semiconductor Corporation Document #: 38-05161Rev. *E
*
3901 North First Street
*
San Jose, CA 95134
* 408-943-2600 Revised April 5, 2004
CY7C1354A CY7C1356A
.
Functional Block Diagram--256K x 36[1]
ZZ MODE CKE# CEN 256K x 9 x 4 SRAM Array
Address
ADV/LD ADV/LD#
R/W# WEN BWa#, BWb# BWa, BWb, BWc#, BWd# BWc, BWd CE#, CE2#, CE CE, CE , CE2
2 3
Control
SA0, SA1, SA CEN
A0, A1, A
Control Logic
Mux
CLK
Output Registers
OE# OE
Output Buffers
DQa-DQd
Functional Block Diagram--512K x 18[1]
ZZ MODE CKE# CEN 1M x 9 x 2 SRAM Array
Address
ADV/LD ADV/LD#
Input Registers
WEN R/W# BWa, BWb BWa#, BWb#
CE#, CE2#, CE2 CE, CE2, CE3 SA0, SA1, SA CEN
Control
A0, A1, A
Control Logic
Mux
CLK
Output Registers
OE# OE
Output Buffers
DQa, DQb
Note: 1. The Functional Block Diagram illustrates simplified device operation. See Truth Table, pin descriptions, and timing diagrams for detailed information.
Document #: 38-05161Rev. *E
DO Sel
DI
Input Registers
DO Sel
DI
Input Registers
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CY7C1354A CY7C1356A
Pin Configurations
100-lead TQFP Packages
A A CE CE2 BWd BWc BWb BWa CE3 VCC VSS CLK WEN CEN OE ADV/LD NC A
A A CE CE2 NC NC BWb BWa CE3 VCC VSS CLK WEN CEN OE ADV/LD NC A
DQb DQb DQb VCCQ VSS
A A
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
DQc DQc DQc VCCQ
VSS DQc DQc DQc DQc VSS VCCQ DQc DQc VCC VCC VCC VSS DQd DQd VCCQ VSS DQd DQd DQd DQd VSS VDDQ DQd DQd DQd
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
CY7C1354A (256K x 36)
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
NC NC NC VCCQ VSS NC NC DQb DQb VSS VCCQ DQb DQb VCC VCC VCC VSS DQb DQb VCCQ VSS DQb DQb DPb NC VSS VCCQ NC NC NC
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
DQb DQb DQb DQb VSS VDDQ DQb DQb VSS VCC VCC ZZ DQa DQa VCCQ VSS DQa DQa DQa DQa VSS VCCQ DQa DQa DQa 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
A A
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 A NC NC VCCQ VSS NC DQa DQa DQa VSS VCCQ DQa DQa VSS VCC VCC ZZ DQa DQa VCCQ VSS DQa DQa NC NC VSS VCCQ NC NC NC
CY7C1356A (512K x 18)
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
MODE A A A A A1 A0 TMS TDI VSS VCC
TDO TCK A A A A A A A
Document #: 38-05161Rev. *E
MODE A A A A A1 A0 TMS TDI VSS VCC
TDO TCK A A A A A A A
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
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CY7C1354A CY7C1356A
Pin Configurations (continued)
119-ball Bump BGA CY7C1354A (256K x 36)-7 x 17 BGA
Table 1. 1 A B C D E F G H J K L M N P R T U VCCQ NC NC DQc DQc VCCQ DQc DQc VCCQ DQd DQd VCCQ DQd DQd NC NC VCCQ 2 A CE2 A DQc DQc DQc DQc DQc VCC DQd DQd DQd DQd DQd A NC TMS 3 A A A VSS VSS VSS BWc VSS NC VSS BWd VSS VSS VSS MODE A TDI 4 NC ADV/LD VCC NC CE OE A WEN VCC CLK NC CEN A1 A0 VCC A TCK 5 A A A VSS VSS VSS BWb VSS NC VSS BWa VSS VSS VSS VSS A TDO 6 A CE3 A DQb DQb DQb DQb DQb VCC DQa DQa DQa DQa DQa A NC NC 7 VCCQ NC NC DQb DQb VCCQ DQb DQb VCCQ DQa DQa VCCQ DQa DQa NC ZZ VCCQ
CY7C1356A (512K x 18)-7 x 17 BGA
Table 1. 1 A B C D E F G H J K L M N P R T U VCCQ NC NC DQb NC VCCQ NC DQb VCCQ NC DQb VCCQ DQb NC NC NC VCCQ 2 A CE2 A NC DQb NC DQb NC VCC DQb NC DQb NC DQb A A TMS 3 A A A VSS VSS VSS BWb VSS NC VSS VSS VSS VSS VSS MODE A TDI 4 NC ADV/LD VCC NC CE OE A WEN VCC CLK NC CEN A1 A0 VCC NC TCK 5 A A A VSS VSS VSS VSS VSS NC VSS BWa VSS VSS VSS VCC A TDO 6 A CE3 A DQa NC DQa NC DQa VCC NC DQa NC DQa NC A A NC 7 VCCQ NC NC NC DQa VCCQ DQa NC VCCQ DQa NC VCCQ NC DQa NC ZZ VCCQ
Document #: 38-05161Rev. *E
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CY7C1354A CY7C1356A
Pin Descriptions--256K x 36
256K x 36 TQFP Pins 37, 36, 32, 33, 34, 35, 44, 45, 46, 47, 48, 49, 50, 81, 82, 83, 99, 100 93, 94, 95, 96 256K x 36 PBGA Pins 4P 4N 2A, 3A, 5A, 6A, 3B, 5B, 2C, 3C, 5C, 6C, 4G, 2R, 6R, 3T, 4T, 5T 5L 5G 3G 3L Pin Name A0, A1, A Type Pin Description
InputSynchronous Address Inputs: The address register is triggered by a Synchronous combination of the rising edge of CLK, ADV/LD LOW, CEN LOW and true chip enables. A0 and A1 are the two least significant bits (LSBs) of the address field and set the internal burst counter if burst cycle is initiated.
BWa, InputSynchronous Byte Write Enables: Each nine-bit byte has its own BWb, Synchronous active LOW byte Write enable. On load Write cycles (when WEN and BWc, ADV/LD are sampled LOW), the appropriate byte Write signal (BWx) BWd must be valid. The byte Write signal must also be valid on each cycle of a burst Write. Byte Write signals are ignored when WEN is sampled HIGH. The appropriate byte(s) of data are written into the device two cycles later. BWa controls DQa pins; BWb controls DQb pins; BWc controls DQc pins; BWd controls DQd pins. BWx can all be tied LOW if always doing Writes to the entire 36-bit word. CEN InputSynchronous Clock Enable Input: When CEN is sampled HIGH, all Synchronous other synchronous inputs, including clock are ignored and outputs remain unchanged. The effect of CEN sampled HIGH on the device outputs is as if the LOW-to-HIGH clock transition did not occur. For normal operation, CEN must be sampled LOW at rising edge of clock. InputRead Write: WEN signal is a synchronous input that identifies whether Synchronous the current loaded cycle and the subsequent burst cycles initiated by ADV/LD is a Read or Write operation. The data bus activity for the current cycle takes place two clock cycles later. InputClock: This is the clock input to CY7C1354A. Except for OE, ZZ and Synchronous MODE, all timing references for the device are made with respect to the rising edge of CLK. InputSynchronous Active LOW Chip Enable: CE and CE3 are used with Synchronous CE2 to enable the CY7C1354A. CE or CE3 sampled HIGH or CE2 sampled LOW, along with ADV/LD LOW at the rising edge of clock, initiates a deselect cycle. The data bus will be High-Z two clock cycles after chip deselect is initiated. InputSynchronous Active High Chip Enable: CE2 is used with CE and CE3 Synchronous to enable the chip. CE2 has inverted polarity but otherwise is identical to CE and CE3. Input Asynchronous Output Enable: OE must be LOW to Read data. When OE is HIGH, the I/O pins are in high-impedance state. OE does not need to be actively controlled for Read and Write cycles. In normal operation, OE can be tied LOW.
87
4M
88
4H
WEN
89
4K
CLK
98, 92
4E, 6B
CE, CE3
97
2B
CE2 OE
86
4F
85
4B
ADV/ InputAdvance/Load: ADV/LD is a synchronous input that is used to load the LD Synchronous internal registers with new address and control signals when it is sampled LOW at the rising edge of clock with the chip is selected. When ADV/LD is sampled HIGH, then the internal burst counter is advanced for any burst that was in progress. The external addresses and WEN are ignored when ADV/LD is sampled HIGH. MOD E ZZ InputStatic Burst Mode: When MODE is HIGH or NC, the interleaved burst sequence is selected. When MODE is LOW, the linear burst sequence is selected. MODE is a static DC input.
31
3R
64
7T
InputSleep Enable: This active HIGH input puts the device in low power Asynchronous consumption standby mode. For normal operation, this input has to be either LOW or NC.
Document #: 38-05161Rev. *E
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CY7C1354A CY7C1356A
Pin Descriptions--256K x 36 (continued)
256K x 36 TQFP Pins 51, 52, 53, 56-59, 62, 63 68, 69, 72-75, 78, 79, 80 1, 2, 3, 6-9, 12, 13 18, 19, 22-25, 28, 29, 30 256K x 36 PBGA Pins (a) 6P, 7P, 7N, 6N, 6M, 6L, 7L, 6K, 7K, (b) 7H, 6H, 7G, 6G, 6F, 6E, 7E, 7D, 6D, (c) 2D, 1D, 1E, 2E, 2F, 1G, 2G, 1H, 2H, (d) 1K, 2K, 1L, 2L, 2M, 1N, 2N, 1P, 2P 2U 3U 4U 5U Pin Name DQa DQb DQc DQd Type Input/ Output Pin Description Data Inputs/Outputs: Both the data input path and data output path are registered and triggered by the rising edge of CLK. Byte "a" is DQa pins; Byte "b" is DQb pins; Byte "c" is DQc pins; Byte "d" is DQd pins.
38 39 43 42
TMS TDI TCK TDO VCC VSS
Input
IEEE 1149.1 Test Inputs: LVTTL-level inputs. If Serial Boundary Scan (JTAG) is not used, these pins can be floating (i.e., No Connect) or be connected to VCC. IEEE 1149.1 Test Output: LVTTL-level output. If Serial Boundary Scan (JTAG) is not used, these pins can be floating (i.e., No Connect). Power Supply: +3.3V -5% and +5%. Ground: GND.
Output Supply Ground
14, 15, 16, 41, 4C, 2J, 4J, 6J, 65, 66, 91 4R, 5R 5, 10, 17, 21, 3D, 5D, 3E, 5E, 26, 40, 55, 60, 3F, 5F, 3H, 5H, 67, 71, 76, 90 3K, 5K, 3M, 5M, 3N, 5N, 3P, 5P
4, 11, 20, 27, 1A, 7A, 1F, 7F, VCCQ 54, 61, 70, 77 1J, 7J, 1M, 7M, 1U, 7U 84 4A, 1B, 7B, 1C, 7C, 4D, 3J, 5J, 4L, 1R, 7R, 1T, 2T, 6T, 6U NC
I/O Supply
Output Buffer Supply: +3.3V -0.165V and +0.165V for 3.3V I/O. +2.5V -0.125V and +0.4V for 2.5V I/O. No Connect: These signals are not internally connected. It can be left floating or be connected to VCC or to GND.
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Pin Descriptions--512K x 18
512K x 18 TQFP Pins 37, 36, 32, 33, 34, 35, 44, 45, 46, 47, 48, 49, 50, 80, 81, 82, 83, 99, 100 93, 94, 512K x 18 PBGA Pins 4P 4N 2A, 3A, 5A, 6A, 3B, 5B, 6B, 2C, 3C, 5C, 6C, 4G, 2R, 6R, 2T, 3T, 5T, 6T 5L 3G Pin Name A0, A1, A Type Pin Description
InputSynchronous Address Inputs: The address register is triggered by a Synchronous combination of the rising edge of CLK, ADV/LD LOW, CEN LOW, and true chip enables. A0 and A1 are the two least significant bits of the address field and set the internal burst counter if burst cycle is initiated.
InputSynchronous Byte Write Enables: Each nine-bit byte has its own BWa, BWb Synchronous active LOW byte Write enable. On load Write cycles (when WEN and ADV/LD are sampled LOW), the appropriate byte Write signal (BWx) must be valid. The byte Write signal must also be valid on each cycle of a burst Write. Byte Write signals are ignored when WEN is sampled HIGH. The appropriate byte(s) of data are written into the device two cycles later. BWa controls DQa pins; BWb controls DQb pins. BWx can all be tied LOW if always doing Write to the entire 18-bit word. CEN InputSynchronous Clock Enable Input: When CEN is sampled HIGH, all Synchronous other synchronous inputs, including clock are ignored and outputs remain unchanged. The effect of CEN sampled HIGH on the device outputs is as if the LOW-to-HIGH clock transition did not occur. For normal operation, CEN must be sampled LOW at rising edge of clock. Page 6 of 28
87
4M
Document #: 38-05161Rev. *E
CY7C1354A CY7C1356A
Pin Descriptions--512K x 18 (continued)
512K x 18 TQFP Pins 88 512K x 18 PBGA Pins 4H Pin Name WEN Type Pin Description
InputRead Write: WEN signal is a synchronous input that identifies whether Synchronous the current loaded cycle and the subsequent burst cycles initiated by ADV/LD is a Read or Write operation. The data bus activity for the current cycle takes place two clock cycles later. InputClock: This is the clock input to CY7C1356A. Except for OE, ZZ, and Synchronous MODE, all timing references for the device are made with respect to the rising edge of CLK. InputSynchronous Active LOW Chip Enable: CE and CE3 are used with Synchronous CE2 to enable the CY7C1356A. CE or CE3 sampled HIGH or CE2 sampled LOW, along with ADV/LD LOW at the rising edge of clock, initiates a deselect cycle. The data bus will be High-Z two clock cycles after chip deselect is initiated. InputSynchronous Active HIGH Chip Enable: CE2 is used with CE and CE3 Synchronous to enable the chip. CE2 has inverted polarity but otherwise is identical to CE and CE3. Input Asynchronous Output Enable: OE must be LOW to Read data. When OE is HIGH, the I/O pins are in high-impedance state. OE does not need to be actively controlled for Read and write cycles. In normal operation, OE can be tied LOW.
89
4K
CLK
98, 92
4E, 6B
CE, CE3
97
2B
CE2 OE
86
4F
85
4B
ADV InputAdvance/Load: ADV/LD is a synchronous input that is used to load the /LD Synchronous internal registers with new address and control signals when it is sampled LOW at the rising edge of clock with the chip is selected. When ADV/LD is sampled HIGH, then the internal burst counter is advanced for any burst that was in progress. The external addresses and WEN are ignored when ADV/LD is sampled HIGH. MOD E ZZ InputStatic Burst Mode: When MODE is HIGH or NC, the interleaved burst sequence is selected. When MODE is LOW, the linear burst sequence is selected. MODE is a static DC input.
31
3R
64
7T
InputSleep Enable: This active HIGH input puts the device in low power Asynchronou consumption standby mode. For normal operation, this input has to be s either LOW or NC. Input/ Output Data Inputs/Outputs: Both the data input path and data output path are registered and triggered by the rising edge of CLK. Byte "a" is DQa pins; Byte "b" is DQb pins.
58, 59, 62, 63, 68, 69, 72, 73, 74 8, 9, 12, 13, 18, 19, 22, 23, 24 38 39 43 42
(a) 6D, 7E, 6F, 7G, 6H, 7K, 6L, 6N, 7P (b) 1D, 2E, 2G, 1H, 2K, 1L, 2M, 1N, 2P 2U 3U 4U 5U
DQa DQb
TMS TDI TCK TDO VCC VSS
Input
IEEE 1149.1 Test Inputs: LVTTL-level inputs. If Serial Boundary Scan (JTAG) is not used, these pins can be floating (i.e., No Connect) or be connected to VCC. IEEE 1149.1 Test Inputs: LVTTL-level output. If Serial Boundary Scan (JTAG) is not used, these pins can be floating (i.e., No Connect). Power Supply: +3.3V -5% and +5%. Ground: GND.
Output Supply Ground
14, 15, 16, 41, 4C, 2J, 4J, 6J, 65, 66, 91 4R, 5R 5, 10, 17, 21, 3D, 5D, 3E, 5E, 26, 40, 55, 60, 3F, 5F, 5G, 3H, 67, 71, 76, 90 5H, 3K, 5K, 3L, 3M, 5M, 3N, 5N, 3P, 5P
4, 11, 20, 27, 1A, 7A, 1F, 7F, VCCQ 54, 61, 70, 77 1J, 7J, 1M, 7M, 1U, 7U
I/O Supply
Output Buffer Supply: +3.3V -0.165V and +0.165V for 3.3V I/O. +2.5V -0.125V and +0.4V for 2.5V I/O.
Document #: 38-05161Rev. *E
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CY7C1354A CY7C1356A
Pin Descriptions--512K x 18 (continued)
512K x 18 TQFP Pins 1-3, 6, 7, 25, 28-30, 51-53, 56, 57, 75, 78, 79, 84, 95, 96 512K x 18 PBGA Pins 4A, 1B, 7B, 1C, 7C, 2D, 4D, 7D, 1E, 6E, 2F, 1G, 6G, 2H, 7H, 3J, 5J, 1K, 6K, 2L, 4L, 7L, 6M, 2N, 7N, 1P, 6P, 1R, 7R, 1T, 4T, 6U Pin Name NC Type - Pin Description No Connect: These signals are not internally connected. It can be left floating or be connected to VCC or to GND.
Partial Truth Table for Read/Write[2]
Function Read No Write Write Byte a (DQa)
[3]
WEN H L L L L L L
BWa X H L H H H L
BWb X H H L H H L
BWc[4] X H H H L H L
BWd[4] X H H H H L L
Write Byte b (DQb)[3] Write Byte c (DQc)[3] Write Byte d (DQd} Write all bytes
[3]
Interleaved Burst Address Table (MODE = VCC or NC)
First Address (external) A...A00 A...A01 A...A10 A...A11 Second Address (internal) A...A01 A...A00 A...A11 A...A10 Third Address (internal) A...A10 A...A11 A...A00 A...A01 Fourth Address (internal)[5] A...A11 A...A10 A...A01 A...A00
Linear Burst Address Table (MODE = VSS)
First Address (external) A...A00 A...A01 A...A10 A...A11 Second Address (internal) A...A01 A...A10 A...A11 A...A00 Third Address (internal) A...A10 A...A11 A...A00 A...A01 Fourth Address (internal)[5] A...A11 A...A00 A...A01 A...A10
Notes: 2. L means logic LOW. H means logic HIGH. X means Don't Care. 3. Multiple bytes may be selected during the same cycle. 4. BWc and BWd apply to 256K x 36 device only. 5. Upon completion of the Burst sequence, the counter wraps around to its initial state and continues counting.
Document #: 38-05161Rev. *E
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CY7C1354A CY7C1356A
Sleep Mode The ZZ input pin is an asynchronous input. Asserting ZZ places the SRAM in a power conservation "sleep" mode. Two clock cycles are required to enter into or exit from this "sleep" mode. While in this mode, data integrity is guaranteed. Accesses pending when entering the "sleep" mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected prior to entering the "sleep" mode. CEs must remain inactive for the duration of tZZREC after the ZZ input returns LOW. CEN needs to active before going into the ZZ mode and before you want to come back out of the ZZ mode.
ZZ Mode Electrical Characteristics
Parameter IDDZZ tZZS tZZREC Description Sleep mode standby current Device operation to ZZ ZZ recovery time Test Conditions ZZ > VDD - 0.2V ZZ > VDD - 0.2V ZZ < 0.2V 2tCYC Min. Max. 10 2tCYC Unit mA ns ns
Truth Table[9, 10, 11, 12, 13, 14, 15, 16, 17]
Operation Deselect Cycle Continue Deselect/NOP[18] Read Cycle (Begin Burst) Read Cycle (Continue Burst)[18] Dummy Read (Begin Burst)[19] Dummy Read (Continue Burst)[18, 19] Write Cycle (Begin Burst) Write Cycle (Continue Burst)[18] Abort Write (Begin Burst)[19] Abort Write (Continue Burst)[18, 19] Ignore Clock Edge/NOP[20] Previous Cycle X Deselect X Read X Read X Write X Write X Address Used X X External Next External Next External Next External Next X WEN ADV/LD X X H X H X L X L X X L H L H L H L H L H H CE H X L X L X L X L X X CEN L L L L L L L L L L H BWx X X X X X X L L H H X DQ OE (2 cycles later) X X X X H H X X X X X High-Z High-Z Q Q High-Z High-Z D D High-Z High-Z -
Notes: 6. This assumes that CEN, CE, CE2 and CE3 are all True. 7. All addresses, control and data-in are only required to meet set-up and hold time with respect to the rising edge of clock. Data out is valid after a clock-to-data delay from the rising edge of clock. 8. DQc and DQd apply to 256K x 36 device only. 9. L means logic LOW. H means logic HIGH. X means Don't Care. High-Z means High Impedance. BWx = L means [BWa*BWb*BWc*BWd] = LOW. BWx = H means [BWa*BWb*BWc*BWd] = HIGH. BWc and BWd apply to 256K x 36 device only. 10. CE = H means CE and CE3 are LOW along with CE2 HIGH. CE = L means CE or CE3 are HIGH or CE2 is LOW. CE = X means CE, CE3, and CE2 are Don't Care. 11. BWa enables Write to byte "a" (DQa pins). BWb enables Write to byte "b" (DQb pins). BWc enables Write to byte "c" (DQc pins). BWd enables Write to byte "d" (DQd pins). DQc, DQd, BWc, and BWd apply to 256K x 36 device only. 12. The device is not in Sleep Mode, i.e., the ZZ pin is LOW. 13. During Sleep Mode, the ZZ pin is HIGH and all the address pins and control pins are "Don't Care." The SNOOZE MODE can only be entered two cycles after the Write cycle, otherwise the Write cycle may not be completed. 14. All inputs, except OE, ZZ, and MODE pins, must meet set-up time and hold time specification against the clock (CLK) LOW-to-HIGH transition edge. 15. OE may be tied to LOW for all the operation. This device automatically turns off the output driver during Write cycle. 16. Device outputs are ensured to be in High-Z during device power-up. 17. This device contains a two-bit burst counter. The address counter is incremented for all Continue Burst cycles. Address wraps to the initial address every fourth burst cycle. 18. Continue Burst cycles, whether Read or Write, use the same control signals. The type of cycle performed, Read or Write, depends upon the WEN control signal at the Begin Burst cycle. A Continue Deselect cycle can only be entered if a DESELECT cycle is executed first. 19. Dummy Read and Abort Write cycles can be entered to set up subsequent Read or Write cycles or to increment the burst counter. 20. When an Ignore Clock Edge cycle enters, the output data (Q) will remain the same if the previous cycle is Read cycle or remain High-Z if the previous cycle is Write or DESELECT cycle.
Document #: 38-05161Rev. *E
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CY7C1354A CY7C1356A
IEEE 1149.1 Serial Boundary Scan (JTAG)
Overview This device incorporates a serial boundary scan access port (TAP). This port is designed to operate in a manner consistent with IEEE Standard 1149.1-1990 (commonly referred to as JTAG), but does not implement all of the functions required for IEEE 1149.1 compliance. Certain functions have been modified or eliminated because their implementation places extra delays in the critical speed path of the device. Nevertheless, the device supports the standard TAP controller architecture (the TAP controller is the state machine that controls the TAPs operation) and can be expected to function in a manner that does not conflict with the operation of devices with IEEE Standard 1149.1-compliant TAPs. The TAP operates using LVTTL/LVCMOS logic level signaling. Disabling the JTAG Feature It is possible to use this device without using the JTAG feature. To disable the TAP controller without interfering with normal operation of the device, TCK should be tied LOW (VSS) to prevent clocking the device. TDI and TMS are internally pulled up and may be unconnected. They may alternately be pulled up to VCC through a resistor. TDO should be left unconnected. Upon power-up the device will come up in a reset state which will not interfere with the operation of the device. Performing a TAP Reset The TAP circuitry does not have a reset pin (TRST, which is optional in the IEEE 1149.1 specification). A RESET can be performed for the TAP controller by forcing TMS HIGH (VCC) for five rising edges of TCK and pre-loads the instruction register with the IDCODE command. This type of reset does not affect the operation of the system logic. The reset affects test logic only. At power-up, the TAP is reset internally to ensure that TDO is in a High-Z state.
TAP Registers
Overview The various TAP registers are selected (one at a time) via the sequences of ones and zeros input to the TMS pin as the TCK is strobed. Each of the TAP registers is a serial shift register that captures serial input data on the rising edge of TCK and pushes serial data out on subsequent falling edge of TCK. When a register is selected, it is connected between the TDI and TDO pins. Instruction Register The instruction register holds the instructions that are executed by the TAP controller when it is moved into the run test/idle or the various data register states. The instructions are three bits long. The register can be loaded when it is placed between the TDI and TDO pins. The parallel outputs of the instruction register are automatically preloaded with the IDCODE instruction upon power-up or whenever the controller is placed in the test-logic reset state. When the TAP controller is in the Capture-IR state, the two least significant bits of the serial instruction register are loaded with a binary "01" pattern to allow for fault isolation of the board-level serial test data path. Bypass Register The bypass register is a single-bit register that can be placed between TDI and TDO. It allows serial test data to be passed through the device TAP to another device in the scan chain with minimum delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed. Boundary Scan Register The Boundary Scan register is connected to all the input and bidirectional I/O pins (not counting the TAP pins) on the device. This also includes a number of NC pins that are reserved for future needs. There are a total of 70 bits for x36 device and 51 bits for x18 device. The boundary scan register, under the control of the TAP controller, is loaded with the contents of the device I/O ring when the controller is in Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. The EXTEST, SAMPLE/ PRELOAD and SAMPLE-Z instructions can be used to capture the contents of the I/O ring. The Boundary Scan Order table describes the order in which the bits are connected. The first column defines the bit's position in the boundary scan register. The MSB of the register is connected to TDI, and LSB is connected to TDO. The second column is the signal name and the third column is the bump number. The third column is the TQFP pin number and the fourth column is the BGA bump number.
Test Access Port
TCK-Test Clock (INPUT) Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate from the falling edge of TCK. TMS-Test Mode Select (INPUT) The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP controller state machine. It is allowable to leave this pin unconnected if the TAP is not used. The pin is pulled up internally, resulting in a logic HIGH level. TDI-Test Data In (INPUT) The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers placed between TDI and TDO. The register placed between TDI and TDO is determined by the state of the TAP controller state machine and the instruction that is currently loaded in the TAP instruction register (refer to Figure 1, TAP Controller State Diagram). It is allowable to leave this pin unconnected if it is not used in an application. The pin is pulled up internally, resulting in a logic HIGH level. TDI is connected to the most significant bit (MSB) of any register (see Figure 2). TDO-Test Data Out (OUTPUT) The TDO output pin is used to serially clock data-out from the registers. The output that is active depending on the state of the TAP state machine (refer to Figure 1, TAP Controller State Diagram). Output changes in response to the falling edge of TCK. This is the output side of the serial registers placed between TDI and TDO. TDO is connected to the LSB of any register (see Figure 2).
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Identification (ID) Register The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in Capture-DR state with the IDCODE command loaded in the instruction register. The register is then placed between the TDI and TDO pins when the controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins. The code is loaded from a 32-bit on-chip ROM. It describes various attributes of the device as described in the Identification Register Definitions table. IDCODE The IDCODE instruction causes a vendor-specific, 32-bit code to be loaded into the ID register when the controller is in Capture-DR mode and places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction loaded in the instruction upon power-up and at any time the TAP controller is placed in the test-logic reset state. SAMPLE-Z If the High-Z instruction is loaded in the instruction register, all output pins are forced to a High-Z state and the boundary scan register is connected between TDI and TDO pins when the TAP controller is in a Shift-DR state. SAMPLE/PRELOAD SAMPLE/PRELOAD is an IEEE 1149.1-mandatory instruction. The PRELOAD portion of the command is not implemented in this device, so the device TAP controller is not fully IEEE 1149.1-compliant. When the SAMPLE/PRELOAD instruction is loaded in the instruction register and the TAP controller is in the Capture-DR state, a snap shot of the data in the device's input and I/O buffers is loaded into the boundary scan register. Because the device system clock(s) are independent from the TAP clock (TCK), it is possible for the TAP to attempt to capture the input and I/O ring contents while the buffers are in transition (i.e., in a metastable state). Although allowing the TAP to sample metastable inputs will not harm the device, repeatable results can not be expected. To guarantee that the boundary scan register will capture the correct value of a signal, the device input signals must be stabilized long enough to meet the TAP controller's capture set-up plus hold time (tCS plus tCH). The device clock input(s) need not be paused for any other TAP operation except capturing the input and I/O ring contents into the boundary scan register. Moving the controller to Shift-DR state then places the boundary scan register between the TDI and TDO pins. Because the PRELOAD portion of the command is not implemented in this device, moving the controller to the Update-DR state with the SAMPLE/PRELOAD instruction loaded in the instruction register has the same effect as the Pause-DR command. BYPASS When the BYPASS instruction is loaded in the instruction register and the TAP controller is in the Shift-DR state, the bypass register is placed between TDI and TDO. This allows the board level scan path to be shortened to facilitate testing of other devices in the scan path. Reserved Do not use these instructions. They are reserved for future use.
TAP Controller Instruction Set
Overview There are two classes of instructions defined in the IEEE Standard 1149.1-1990; the standard (public) instructions and device specific (private) instructions. Some public instructions are mandatory for IEEE 1149.1 compliance. Optional public instructions must be implemented in prescribed ways. Although the TAP controller in this device follows the IEEE 1149.1 conventions, it is not IEEE 1149.1-compliant because some of the mandatory instructions are not fully implemented. The TAP on this device may be used to monitor all input and I/O pads, but can not be used to load address, data, or control signals into the device or to preload the I/O buffers. In other words, the device will not perform IEEE 1149.1 EXTEST, INTEST, or the preload portion of the SAMPLE/PRELOAD command. When the TAP controller is placed in Capture-IR state, the two least significant bits of the instruction register are loaded with 01. When the controller is moved to the Shift-IR state the instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction sets for this device are listed in the following tables. EXTEST EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with all 0s. EXTEST is not implemented in this device. The TAP controller does recognize an all-0 instruction. When an EXTEST instruction is loaded into the instruction register, the device responds as if a SAMPLE/PRELOAD instruction has been loaded. There is one difference between two instructions. Unlike SAMPLE/PRELOAD instruction, EXTEST places the device outputs in a High-Z state.
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1 TEST-LOGIC RESET 0 0 REUN-TEST/ IDLE 1 SELECT DR-SCAN 0 1 CAPTURE-DR 0 SHIFT-DR 1 EXIT1-DR 0 PAUSE-DR 1 0 EXIT2-DR 1 UPDATE-DR 1 0 0 0 1 0 1 1 SELECT IR-SCAN 0 CAPTURE-IR 0 SHIFT-IR 1 EXIT1-IR 0 PAUSE-IR 1 EXIT2-IR 1 UPDATE-IR 1 0 0 1 0 1
Figure 1. TAP Controller State Diagram[21]
Note: 21. The "0"/"1" next to each state represents the value at TMS at the rising edge of TCK.
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0 Bypass Register Selection Circuitry TDI Selection Circuitry TDO
2 Instruction Register
1
0
31 30
29
.
.
2
1
0
Identification Register x . . . . 2 1 0
Boundary Scan Register [22]
TDI TAP Controller TDI
Figure 2. TAP Controller Block Diagram
TAP Electrical Characteristics (20C < Tj < 110C; VCC = 3.3V -0.2V and +0.3V unless otherwise noted)
Parameter VIH VIl ILI ILI ILO VOLC VOHC VOLT VOHT Description Input High (Logic 1) Voltage[23, 24] Input Low (Logic 0) Voltage[23, 24] Input Leakage Current TMS and TDI Input Leakage Current Output Leakage Current LVCMOS Output Low Voltage[23, 25] LVCMOS Output High Voltage LVTTL Output Low Voltage[23] LVTTL Output High Voltage[23]
[23, 25]
Test Conditions
Min. 2.0 -0.3
Max. VCC + 0.3 0.8 5.0 30 5.0 0.2
Unit V V A A A V V V V
0V < VIN < VCC 0V < VIN < VCC Output disabled, 0V < VIN < VCCQ IOLC = 100 A IOHC = 100 A IOLT = 8.0 mA IOHT = 8.0 mA
-5.0 -30 -5.0
VCC - 0.2 0.4 2.4
Notes: 22. X = 69 for the x36 configuration; X = 50 for the x18 configuration. 23. All voltage referenced to VSS (GND). 24. Overshoot: VIH(AC) < VCC + 1.5V for t < tKHKH/2; undershoot: VIL(AC) <-0.5V for t < tKHKH/2; power-up: VIH < 3.6V and VCC < 3.135V and VCCQ < 1.4V for t < 200 ms. During normal operation, VCCQ must not exceed VCC. Control input signals (such as WEN and ADV/LD) may not have pulse widths less than tKHKL (min.). 25. This parameter is sampled.
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TAP AC Switching Characteristics Over the Operating Range[26, 27]
Parameter Clock tTHTH fTF tTHTL tTLTH Output Times tTLQX tTLQV tDVTH tTHDX Set-up Times tMVTH tTDIS tCS Hold Times tTHMX tTDIH tCH TMS Hold TDI Hold Capture Hold 5 5 5 ns ns ns TMS Set-up TDI Set-up Capture Set-up 5 5 5 ns ns ns TCK LOW to TDO Unknown TCK LOW to TDO Valid TDI Valid to TCK HIGH TCK HIGH to TDI Invalid 5 5 0 10 ns ns ns ns Clock Cycle Time Clock Frequency Clock HIGH Time Clock LOW Time 8 8 20 50 ns MHz ns ns Description Min. Max. Unit
Notes: 26. tCS and tCH refer to the set-up and hold time requirements of latching data from the boundary scan register. 27. Test conditions are specified using the load in TAP AC test conditions.
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TAP Timing and Test Conditions
1.5V 50 TDO Z0 = 50 CL = 20 pF VSS ALL INPUT PULSES 3.0V 1.5V 1.5 ns 1.5 ns
GND
(a)
tTHTH t
THTL
t
TLTH
TEST CLOCK (TCK)
tMVTH tTHMX
TEST MODE SELECT (TMS)
tDVTH tTHDX
TEST DATA IN (TDI)
t
TLQV
tTLQX
TEST DATA OUT (TDO)
Identification Register Definitions
Instruction Field Revision Number(31:28) Device Depth (27:23) Device Width (22:18) Reserved (17:12) Cypress Jedec ID Code (11:1) ID Register Presence Indicator (0) 256K x 36 XXXX 00110 00100 XXXXXX 00011100100 1 512K x 18 XXXX 00111 00011 XXXXXX 00011100100 1 Description Reserved for revision number. Defines depth of 256K or 512K words. Defines width of x36 or x18 bits. Reserved for future use. Allows unique identification of DEVICE vendor. Indicates the presence of an ID register.
Scan Register Sizes
Register Name Instruction Bypass ID Boundary Scan Bit Size (x36) 3 1 32 70 Bit Size (x18) 3 1 32 51
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Instruction Codes
Instruction EXTEST Code 000 Description Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces all device outputs to High-Z state. This instruction is not IEEE 1149.1-compliant. Preloads ID register with vendor ID code and places it between TDI and TDO. This instruction does not affect device operations. Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces all device outputs to High-Z state. Do not use these instructions; they are reserved for future use. Captures I/O ring contents. Places the boundary scan register between TDI and TDO. This instruction does not affect device operations. This instruction does not implement IEEE 1149.1 PRELOAD function and is therefore not 1149.1-compliant. Do not use these instructions; they are reserved for future use. Do not use these instructions; they are reserved for future use. Places the bypass register between TDI and TDO. This instruction does not affect device operations.
IDCODE SAMPLE-Z RESERVED SAMPLE/PRELOAD
001 010 011 100
RESERVED RESERVED BYPASS
101 110 111
Boundary Scan Order (256K x 36)
Bit# 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Signal Name A A A A A A A DQa DQa DQa DQa DQa DQa DQa DQa DQa ZZ DQb DQb DQb DQb DQb DQb DQb DQb DQb A A TQFP 44 45 46 47 48 49 50 51 52 53 56 57 58 59 62 63 64 68 69 72 73 74 75 78 79 80 81 82 Bump ID 2R 3T 4T 5T 6R 3B 5B 6P 7N 6M 7L 6K 7P 6N 6L 7K 7T 6H 7G 6F 7E 6D 7H 6G 6E 7D 6A 5A
Boundary Scan Order (256K x 36) (continued)
Bit# 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 Signal Name A NC ADV/LD OE CEN WEN CLK CE3 BWa BWb BWc BWd CE2 CE A A DQc DQc DQc DQc DQc DQc DQc DQc DQc NC DQd DQd TQFP 83 84 85 86 87 88 89 92 93 94 95 96 97 98 99 100 1 2 3 6 7 8 9 12 13 14 18 19 Bump ID 4G 4A 4B 4F 4M 4H 4K 6B 5L 5G 3G 3L 2B 4E 3A 2A 2D 1E 2F 1G 2H 1D 2E 2G 1H 5R 2K 1L Page 16 of 28
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Boundary Scan Order (256K x 36) (continued)
Bit# 57 58 59 60 61 62 63 64 65 66 67 68 69 70 Signal Name DQd DQd DQd DQd DQd DQd DQd MODE A A A A A1 A0 TQFP 22 23 24 25 28 29 30 31 32 33 34 35 36 37 Bump ID 2M 1N 2P 1K 2L 2N 1P 3R 2C 3C 5C 6C 4N 4P
Boundary Scan Order (512K x 18) (continued)
Bit# 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 Signal Name CE3 BWa BWb CE2 CE A A DQb DQb DQb DQb NC DQb DQb DQb DQb DQb MODE A A A A A1 A0 TQFP 92 93 94 97 98 99 100 8 9 12 13 14 18 19 22 23 24 31 32 33 34 35 36 37 Bump ID 6B 5L 3G 2B 4E 3A 2A 1D 2E 2G 1H 5R 2K 1L 2M 1N 2P 3R 2C 3C 5C 6C 4N 4P
Boundary Scan Order (512K x 18)
Bit# 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 Signal Name A A A A A A A DQa DQa DQa DQa ZZ DQa DQa DQa DQa DQa A A A A NC ADV/LD OE CEN WEN CLK TQFP 44 45 46 47 48 49 50 58 59 62 63 64 68 69 72 73 74 80 81 82 83 84 85 86 87 88 89 Bump ID 2R 2T 3T 5T 6R 3B 5B 7P 6N 6L 7K 7T 6H 7G 6F 7E 6D 6T 6A 5A 4G 4A 4B 4F 4M 4H 4K
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Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.) Voltage on VCC Supply Relative to VSS ......... -0.5V to +4.6V VIN ...........................................................-0.5V to VCC+0.5V Storage Temperature (plastic) ...................... -55C to +125 Junction Temperature ..................................................+125 Power Dissipation .........................................................2.0W Short Circuit Output Current ....................................... 50 mA Static Discharge Voltage.......................................... > 2001V (per MIL-STD-883, Method 3015) Latch-up Current.................................................... > 200 mA
Operating Range
Range Commercial Industrial Ambient Temperature[28] 0C to +70C -40C to +85C VCC[29,30] VCCQ[29,30] 3.3V 5% 2.5V-5%/ 3.3V+10%
Electrical Characteristics Over the Operating Range
Parameter VIHD VIH VIL ILI ILI ILO VOH VOL VCC VCCQ Input Low (Logic 0) Voltage[23, 31] Description Input High (Logic 1) Voltage[23, 31] 3.3V I/O 2.5V I/O 3.3V I/O 2.5V I/O Input Leakage Current Output Leakage Current Output High Voltage[23] Output Low Voltage[23] Supply Voltage[23] I/O Supply Voltage[23] 0V < VIN < VCC Output(s) disabled, 0V < VOUT < VCC I0H = -5.0 mA for 3.3V I/O I0H = -1.0 mA for 2.5V I/O I0L=8.0 mA for 3.3V I/O I0L = 1.0 mA for 2.5V I/O I0H=1.0 mA 3.3V I/O 2.5V I/O 200 MHz/ -5 560 3.135 3.135 2.375 166 MHz/ -6 480 133 MHz/ -7.5 410 MODE and ZZ Input Leakage Current[32] 0V < VIN < VCC Test Conditions All other Inputs Min. 2.0 2.0 1.7 -0.3 -0.3 2.4 2.0 0.4 0.4 3.465 3.465 2.9 100 MHz/ -10 350 0.8 0.7 5 30 5 Max. VCC + 0.3 Unit V V V V V A A A V V V V V V V
Parameter Description ICC Power Supply Current: Operating[33, 34, 35, 36] ISB1 ISB2 ISB3 ISB4
Conditions Typ. Device selected; all inputs < VILor > 200 VIH; cycle time > tKC min.; VCC =Max.; outputs open, ADV/LD = X, f = fMAX2 Automatic CE Device deselected; Power-down all inputs < VIL or > VIH; VCC = Max.; CLK cycle time > tKC Min. Current--TTL Inputs 15 CMOS Standby[34, 35, 36] Device deselected; VCC = Max.; all inputs < VSS + 0.2 or > VCC - 0.2; all inputs static; CLK frequency = 0 20 TTL Standby[34, 35, 36] Device deselected; all inputs < VIL or > VIH; all inputs static; VCC = Max.; CLK frequency = 0 50 Clock Running[34, 35, 36] Device deselected; all inputs < VIL or > VIH; VCC = MAX; CLK cycle time > tKC Min.
Unit mA
mA
30
30
30
30
mA
50
50
50
50
mA
230
200
190
170
mA
Notes: 28. TA is the case temperature. 29. Please refer to waveform (d). 30. Power Supply ramp up should be monotonic. 31. Overshoot: VIH < +6.0V for t < tKC /2; undershoot: VIL < -2.0V for t < tKC /2. 32. MODE pin has an internal pull-up and ZZ pin has an internal pull-down. These two pins exhibit an input leakage current of 50 A. 33. ICC is given with no output current. ICC increases with greater output loading and faster cycle times. 34. "Device Deselected" means the device is in power-down mode as defined in the truth table. "Device Selected" means the device is active. 35. Typical values are measured at 3.3V, 25C, and 20-ns cycle time. 36. At f = fMAX, inputs are cycling at the maximum frequency of Read cycles of 1/tCYC; f = 0 means no input lines are changing.
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Capacitance[25]
Parameter CI CI/O Description Input Capacitance Input/Output Capacitance (DQ) Test Conditions TA = 25C, f = 1 MHz, VCC = 3.3V Typ. 4 7 Max. 4 6.5 Unit pF pF
Thermal Resistance
Parameter JA JC Description Thermal Resistance (Junction to Ambient) Thermal Resistance (Junction to Case) Test Conditions Still Air, soldered on a 4.25 x 1.125 inch, 4-layer PCB TQFP Typ. 25 9 Unit C/W C/W
AC Test Loads and Waveforms
t PU
= 200us
DQ Z0 = 50 50 Vt = 1.5V
VCCQ DQ 5 pF
317
VCCQ 0V 10% 1.0 ns
ALL INPUT PULSES 90% 90% 10% 1.0 ns
Vcctyp Vccmin
For proper RESET bring Vcc down to 0V
351
(a)
(b)
(c)
(d)
Switching Characteristics Over the Operating Range[17]
-5/ 200 MHz Parameter Clock tKC tKH tKL tKQ tKQX tKQLZ tKQHZ tOEQ tOELZ tOEHZ Set-up Times tS tSD Hold Times tH tHD Address and Controls[40] Data In[40] 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 ns ns Address and Controls[40] Data In
[40]
-6/ 166 MHz Min. 6.0 2.1 2.1 Max.
-7.5/ 133 MHz Min. 7.5 2.6 2.6 Max.
-10/ 100 MHz Min. 10 3.5 3.5 Max. Unit ns ns ns 5.0 1.0 1.0 ns ns ns 3.0 5.0 0 3.5 2.0 2.0 ns ns ns ns ns ns
Description Clock Cycle Time Clock HIGH Time Clock LOW Time Clock to Output Valid Clock to Output Invalid Clock to Output in Low-Z[25, 38, 39] Clock to Output in OE to Output in High-Z[25, 38, 39] OE to Output Valid Low-Z[25, 38, 39]
Min. 5.0 1.8 1.8
Max.
Output Times 3.2 1.0 1.0 1.0 0 3.5 1.5 1.5 1.5 1.5 3.0 3.2 0 3.5 1.8 1.8 1.0 1.0 1.0 3.0 3.6 0 3.5 3.6 1.0 1.0 1.0 3.0 4.2 4.2
1.0
OE to Output in High-Z[25, 38, 39]
Notes: 37. Test conditions as specified with the output loading as shown in (a) of AC Test Loads unless otherwise noted. 38. Output loading is specified with CL=5 pF as in (a) of AC Test Loads. 39. At any given temperature and voltage condition, tKQHZ is less than tKQLZ and tOEHZ is less than tOELZ. 40. This is a synchronous device. All synchronous inputs must meet specified set-up and hold time, except for "don't care" as defined in the truth table.
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Switching Waveforms
Read Timing[41, 42, 43, 44, 45]
tKC tKL tKH
CLK
tS tH
CKE# CEN
tS tH
R/W# WEN
tS tH
ADDRESS
A1
A2
BWa, BWb# BWa#,BWb, BWc, BWd
CE# CE
tS tH tS tH
ADV/LD# ADV/LD OE# OE
tKQLZ tKQ
Q(A) 1 Q(A) 2
tKQX
Q(A+1) 2
(CKE# HIGH eliminates , current L-H clock edge) Q(A+2) 2
(Burst Wraps around to initial state) Q(A+3) 2 Q(A) 2
tKQHZ
DQ
Pipeline Read Pipeline Read
BURST PIPELINE READ
Notes: 41. Q(A1) represents the first output from the external address A1. Q(A2) represents the first output from the external address A2; Q(A2+1) represents the next output data in the burst sequence of the base address A2, etc., where address bits A0 and A1 are advancing for the four word burst in the sequence defined by the state of the MODE input. 42. CE3 timing transitions are identical to the CE signal. For example, when CE is LOW on this waveform, CE3 is LOW. CE2 timing transitions are identical but inverted to the CE signal. For example, when CE is LOW on this waveform, CE2 is HIGH. 43. Burst ends when new address and control are loaded into the SRAM by sampling ADV/LD LOW. 44. WEN is "Don't Care" when the SRAM is bursting (ADV/LD sampled HIGH). The nature of the burst access (Read or Write) is fixed by the state of the WEN signal when new address and control are loaded into the SRAM. 45. BWc and BWd apply to 256K x 36 device only.
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Switching Waveforms (continued)
Write Timing[42, 43, 44, 45, 46, 47]
tKC tKL tKH
CLK
tS tH
CKE# CEN
tS tH
WEN
R/W#
tS tH
ADDRESS
A1
tS
BW(A) 1
A2
BW(A) 2
BWa, BWb# BWa#, BWb, BWc, BWd
CE# CE
tH
BW(A+1) 2
BW(A+2) 2
BW(A+3) 2
BW(A) 2
tS
tH
tS
tH
ADV/LD# ADV/LD OE# OE
tSD tHD
D(A ) 1 D(A ) 2 D(A +1) 2 (CKE# HIGH eliminates , current L-H clock edge) D(A +2) 2 (Burst Wraps around to initial state) D(A +3) 2 D(A ) 2
DQ
Pipeline Write
Burst Pipeline Write
Pipeline Write
Notes: 46. D(A1) represents the first input to the external address A1. D(A2) represents the first input to the external address A2; D(A2 + 1) represents the next input data in the burst sequence of the base address A2, etc., where address bits A0 and A1 are advancing for the four-word burst in the sequence defined by the state of the MODE input. 47. Individual Byte Write signals (BWx) must be valid on all Write and burst-Write cycles. A Write cycle is initiated when WEN signal is sampled LOW when ADV/LD is sampled LOW. The byte Write information comes in one cycle before the actual data is presented to the SRAM.
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Switching Waveforms (continued)
Read/Write Timing[42, 45, 47, 48]
tKC tKL tKH
CLK
tS tH
CKE# CEN
tS tH
R/W# WEN
tS tH
ADDRESS
A1
tS
A2
BW(A) 2
A3
tH
A4
BW(A) 4
A5
BW(A) 5
A6
A7
A8
A9
BWa, BWb, BWa#, BWb# BWc, BWd
CE# CE
tS
tH
tS
tH
ADV/LD# ADV/LD OE# OE
tKQ tKQHZ Q(A ) 1 Read Read D(A) 2 Write Write D(A) 4 D(A) 5 tKQLZ Q(A ) 3 tKQX Q(A ) 6 Read Q(A ) 7
DATA Out (Q) DATA In (D)
Note: 48. Q(A1) represents the first output from the external address A1. D(A2) represents the input data to the SRAM corresponding to address A2.
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CY7C1354A CY7C1356A
Switching Waveforms (continued)
CEN Timing[42, 45, 47, 48, 49]
tKC tKL tKH
CLK
tS tH
CKE# CEN
tS tH
R/W# WEN
tS tH
ADDRESS
A1
tS
A2
tH
A3
A4
A5
BWa, BWb, BWa#, BWb# BWc, BWd
CE# CE
tS
tH
tS
tH
ADV/LD# ADV/LD OE# OE
tKQ tKQHZ
DATA Out (Q)
tKQLZ
Q(A ) 1
tKQX tSD tHD
Q(A ) 3
DATA In (D)
D(A) 2
Note: 49. CEN when sampled HIGH on the rising edge of clock will block that L-H transition of the clock from propagating into the SRAM. The part will behave as if the L-H clock transition did not occur. All internal registers in the SRAM will retain their previous states.
Document #: 38-05161Rev. *E
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CY7C1354A CY7C1356A
Switching Waveforms (continued)
CE Timing[42, 45, 47, 50, 51]
tKC tKL tKH
CLK
tS tH
CKE# CEN
tS tH
R/W# WEN
tS tH
ADDRESS
A1
A2
tS
A3
tH
A4
A5
BWa, BWb, BWa#, BWb# BWc, BWd
tS tH
CE# CE
tS tH
ADV/LD# ADV/LD
tOEQ
OE# OE
tOELZ tKQHZ tOEHZ
DATA Out (Q)
tKQLZ
Q(A ) 1
tKQ
Q(A ) 2
tKQX tSD tHD
Q(A ) 4
DATA In (D)
D(A) 3
Notes: 50. Q(A1) represents the first output from the external address A1. D(A3) represents the input data to the SRAM corresponding to address A3, etc. 51. When either one of the Chip Enables (CE, CE2, or CE3) is sampled inactive at the rising clock edge, a chip deselect cycle is initiated. The data-bus High-Z one cycle after t
Document #: 38-05161Rev. *E
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CY7C1354A CY7C1356A
Switching Waveforms (continued)
ZZ Mode Timing [ 50, 51]
CLK CE1
CE2
LOW
CE3
HIGH
ZZ
tZZS
IDD I/Os
IDD(active) Three-state IDDZZ
tZZREC
Ordering Information
Speed (MHz) 200 166 Ordering Code CY7C1354A-200AC[52] CY7C1354A-200BGC[52] CY7C1354A-166AC[52] CY7C1354A-166BGC[52] CY7C1356A-166AC 133 100 CY7C1354A-133BGC[52] CY7C1356A-133AC CY7C1356A-100AC CY7C1356A-100BGC Speed (MHz) 166 133 Ordering Code CY7C1354A-166BGI[52] CY7C1354A-133BGI CY7C1356A-133AI Package Name A101 BG119 A101 BG119 A101 BG119 A101 A101 BG119 Package Name BG119 BG119 A101 Package Type 100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack 119-ball BGA (14 x 22 x 2.4 mm) 100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack 119-ball BGA (14 x 22 x 2.4 mm) 100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack 119-ball BGA (14 x 22 x 2.4 mm) 100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack 100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack 119-ball BGA (14 x 22 x 2.4 mm) Package Type 119-ball BGA (14 x 22 x 2.4 mm) 119-ball BGA (14 x 22 x 2.4 mm) 100-lead 14 x 20 x 1.4 mm Thin Quad Flat Pack Operating Range Industrial Operating Range Commercial
Shaded areas contain advance information. Please contact your local Cypress sales representative for availability of these parts. Notes: 50.Device must be deselected when entering ZZ mode. See Cycle Descriptions Table for all possible signal conditions to deselect the device. 51. I/Os are in three-state when exiting ZZ sleep mode 52. EOL (End of Life)
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CY7C1354A CY7C1356A
Package Diagrams
100-lead Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) A101
51-85050-A
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CY7C1354A CY7C1356A
Package Diagrams (continued)
119-Lead PBGA (14 x 22 x 2.4 mm) BG119
51-85115-*B
No Bus Latency, NoBL, Zero Bus Latency, and ZBL are trademarks of Cypress Semiconductor Corporation. All product and company names mentioned in this document are the trademarks of their respective holders.
Document #: 38-05161Rev. *E
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(c) Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
CY7C1354A CY7C1356A
Document History Page
Document Title: CY7C1354A/CY7C1356A 256K x 36/512K x 18 Pipelined SRAM with NoBLTM Architecture Document Number: 38-05161 REV. ** *A *B ECN No. 3000 114095 114095 Issue Date 4/21/00 03/12/02 05/30/02 Orig. of Change CXV GLC GLC New Data Sheet Updated VIH, VIL, separate VIH and VIL for 3.3V and 2.5V I/O. Added "I" temp Added automatic power down to features Added ZZ mode to characteristics Added ZZ mode timing waveform Changed nomenclature for ISB Updated latch-up current Added static discharge voltage Updated package diagram 51-85115 (BG119) to rev. *B Added power-up requirements to AC Test Loads and Waveforms and Operating Range Deleted Galvantech info-Title and contents Updated ordering info to match devmaster Description of Change
*C *D *E
121473 123143 216628
11/14/02 01/18/03 03/24/04
DSG RBI VBL
Document #: 38-05161Rev. *E
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